Application of anti-static film in the field of electronic products

Static electricity is a highly destructive hidden risk that is easily overlooked throughout the entire lifecycle of electronic products, from wafer manufacturing, component packaging to terminal shipment. Instantaneous electrostatic discharge may not only directly penetrate core components such as chips, PCB boards, and precision sensors, but also cause a large amount of hidden damage that is difficult to detect during factory inspections. As the most fundamental and critical functional material in electronic protection systems, anti-static films are covering the entire process of electrostatic protection requirements for electronic products through different material formulations and structural designs.

For highly sensitive products such as PCB circuit boards and semiconductor chips, the industry generally uses anti-static PE films with surface resistivity controlled between 10 ⁶ and 10 ⁹ Ω. By adding ionic anti-static agents, the rapid dissipation of charges is achieved, avoiding direct damage to components caused by static electricity generated by human touch and equipment friction on the production line.

In the wafer transportation turnover scenario, top semiconductor manufacturers widely adopt a three-layer composite anti-static film scheme: the outer layer is an aluminum plated polyester film to provide electromagnetic shielding, the middle layer is an anti-static polyethylene film to quickly dissipate charges, and the inner layer is a low friction coating to avoid scratching the wafer surface. This scheme can reduce the static damage rate of wafers during long-distance transportation from 3.2% to 0.15%, greatly improving production yield.