Core strengths
In the fields of precision manufacturing such as semiconductors, optical components, and PCB boards, electrostatic discharge (ESD) can lead to a decrease of over 30% in product yield. Traditional protective materials suffer from uncontrollable conductivity, insufficient transparency, and the risk of secondary pollution. Anti static protective films can effectively solve these problems.
technological breakthrough
Multi layer composite structure
Surface layer: 0.1 μ m ultra-thin conductive layer (surface resistance 10 ^ 6-10 ^ 9 Ω)
Intermediate layer: PET substrate (thickness optional 25-125 μ m)
Bottom layer: anti-static adhesive layer (peel strength ≤ 1.5N/cm)
Innovative performance
Transmittance ≥ 92% (haze ≤ 1.5%)
Static decay time<0.1 seconds (compliant with IEC 61340-5-1 standard)
Temperature resistance range -40 ℃~150 ℃